Surface mount technology, or SMT, serves as the main backbone to GWTï¿½s manufacturing operation. GWT has multiple fully-configured, state of the art, assembly lines that feature semi-automatic screen printing, Fuji high-speed chip shooters, Fuji fine-pitch pick and place equipment, and Heller convection reflow ovens. All the necessary support equipment is present… like a high speed Fuji glue machine, solder machines, and purified water cleaner machines… to complete a fully functional SMT dominated operation. In addition, GWT has added capability and flexibility by having a stand-alone pick & place machine like the Contact 3AV fine pitch pick and place machine to serve our customersï¿½ prototyping and small volume requirements.
Breaking the area into five parts would entail the following mentions: 1) programming and machine setup 2) screen printing 3) automatic placement, both high speed placement and fine pitch 4) solder reflow and 5) automated optical inspection. First, our operation takes the CAD and Gerber data offered by our customers and bridges that to our Fuji/multi-brand equipment to be programmed and optimized for placement of components mentioned in part three above. Second, a solder stencil is used in conjunction with our semi-automatic screen printing equipment to lay solder paste on the PCB, readying the board for component placement. Next, the board makes its way to a line of Fuji chip shooters and Fuji fine pitch placement equipment depending on the dimensions of the task. Next, the board travels to the Heller reflow ovens where the components are reflow soldered to the printed circuit board. Finally, the assemblies undergo automatic SMT inspection using our optical inspection equipment, bringing the accuracy and speed of machine vision to the inspection process so that quality PCBAs are moved forward into subsequent assembly stages and ultimately out the door to the customer.
- SMT Accomodations & Specifications
- Reaching speeds of 50,000 CPH
- Component package sizes to .0201
- Board dimensions to 16″ X 14″ (and occasionally beyond)
- Component package types like BGA, MicroBGA, CSP, & QFP
- Double-sided capability
- Rigid, Flex, Hybrid, and Multi-layer PCBs
- Advice on PCB panelization design
- Custom fixtures designed for manufacturability if required
- Internal 1st Articles always & Customer 1st Articles when required